Cooking appliance surfaces having spill containment pattern and methods of making the same

ABSTRACT

A pattern of high temperature hydrophobic surfaces for use with cooking and baking appliances, such as kitchen cooktops, stoves and oven interior walls. The pattern of hydrophobic surfaces confines overflowed liquids to the enclosed non-hydrophobic surface areas and away from protected areas, such as around burner control knobs, burner surfaces, cal rods, fan and vent openings, countertops, and the like. The hydrophobic materials used are able to withstand and effectively repel liquids at high operating temperatures.

CROSS-REFERENCE TO RELATED APPLICATION

Priority is claimed as a divisional of U.S. patent application Ser. No.13/505,205 filed Apr. 30, 2012, which is the U.S. national stage ofInternational Application No. PCT/US2010/054936 filed Nov. 1, 2010,which claims priority to U.S. Patent Application Ser. No. 61/258,124filed Nov. 4, 2009, the entire disclosures of which are herebyincorporated herein by reference.

FIELD OF THE DISCLOSURE

The disclosure relates to appliances for cooking and baking, which havea spill containment pattern disposed thereon, and methods of making thesame. More particularly, the disclosure is directed to a cookingappliance or cooking appliance surface that includes a spill containmentpattern having a hydrophobic pattern bounding a non-hydrophobic spillcontainment region.

BACKGROUND

The surfaces of various cooking appliances including cooktops, rangetops, stoves, and ovens can be subject to a variety of spills occurringduring the cooking process. These spills must be contained and preventedfrom leaking over the edge of a cooking surface. In general,commercially available cooktops include a molded member or borderencapsulating the edge of the cooktop to prevent spills from exiting thecooktop surface. However, such encapsulating member designs aredifficult to clean and can trap food products and liquid between thecooking appliance surface and the encapsulating member. It can befurther desirable to include a trim member surrounding the burner unit,as a means of directing spilled liquids away from the hot burner unit inorder to prevent the spill from burning, drying out, and crusting on theburner area. However, such trim units also can result in theaccumulation of trapped food or liquid products and are difficult toclean.

SUMMARY OF THE DISCLOSURE

In an embodiment of the present disclosure, a cooking appliance having aspill containment pattern includes a cooking appliance surface having atop surface, the top surface comprising a non-hydrophobic region, atleast one heating element disposed on or adjacent to the cookingappliance surface, and a spill containment pattern comprising ahydrophobic pattern disposed on the top surface and bounding at least aportion of the non-hydrophobic region, the bounded non-hydrophobicregion defining a non-hydrophobic spill containment region.

In another embodiment of the present disclosure, a cooking appliancesurface having a spill containment pattern includes a top surface, thetop surface comprising, wherein at least a portion of the top surface isadapted to be heated by a heating element, and a portion of the topsurface is non-hydrophobic, and a spill containment pattern disposed onthe top surface, the spill containment patter comprising a hydrophobicpattern bounding at least a portion of the non-hydrophobic portion ofthe top surface, the bounded non-hydrophobic portion of the top surfacedefining a non-hydrophobic spill containment region.

In yet another embodiment of the present disclosure, a method ofmanufacturing a cooking appliance surface capable of containing spillsthereon includes providing a cooking appliance surface comprising a topsurface having a non-hydrophobic region, wherein at least a portion ofthe cooking appliance surface is adapted to be heated by at least oneheating element, and forming a hydrophobic pattern on the top surface,the hydrophobic pattern arranged to bound at least a portion of thenon-hydrophobic region, the bounded non-hydrophobic region defining anon-hydrophobic spill containment region.

These and other aspects, advantages and features of the disclosure willbe more fully understood and appreciated by reference to the Descriptionof the Preferred Embodiments, and the appended drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the disclosure will now be described withreference to the drawings in which:

FIGS. 1A and 1B are plan views of a cooktop having a spill containmentpattern with a hydrophobic pattern in the form of a frame-like border,in accordance with an embodiment of the disclosure;

FIGS. 2A and 2B are plan views of a cooktop having a spill containmentpattern with a hydrophobic pattern in the form of a grid pattern, inaccordance with an embodiment of the disclosure;

FIG. 3 is a plan view of a cooktop having a spill containment patternwith a double frame-like border hydrophobic pattern, in accordance withan embodiment of the disclosure;

FIG. 4 is a plan view of a cooktop having a spill containment patternhaving a hydrophobic pattern surrounding burner and control regions ofthe cooktop, in accordance with an embodiment of the disclosure;

FIG. 5 is a plan view of a cooktop having a spill containment patternhaving a hydrophobic pattern surrounding burner, control, and fanregions of the cooktop, in accordance with an embodiment of thedisclosure;

FIG. 6 is a top plan view of the bottom burner wall of an electric ovenhaving a spill containment pattern in accordance with an embodiment ofthe disclosure; and

FIG. 7 is a an isometric view of the side and bottom walls of anelectric oven having a spill containment pattern with a hydrophobicpattern disposed on the angles and bends of the recessed bottom wall, inaccordance with an embodiment of the disclosure.

DETAILED DESCRIPTION

The present disclosure is directed to a cooking appliance surface havinga spill containing pattern disposed on a top surface of the cookingappliance surface. The cooking appliance surface can include the surfaceof any appliance used for cooking and/or baking, such as, cooktops,stovetops, range cooking tops, and ovens. The cooking appliance surfaceof the disclosure can be adapted for use with any commercially availablecooktop, stove, range, oven, or any similar such appliance. The cookingappliance surface can be any shape, including, for example, a rectangle,a lazy s-shape, and an oval. Certain embodiments are especiallyadvantageous for use with cooktops that include a glass or ceramic topsurface with burners disposed beneath the top surface and one or morecontrols disposed on or adjacent to the top surface. At least a portionof the top surface of the cooking appliance surface is adapted to beheated by at least one heating element. For example, the cookingappliance surface can be a cooktop, with a portion of the cook disposednear the burners adapted to be heated by the burners. Alternatively, theentire top surface of the cooking appliance surface can be adapted to beheated by at least one heating element. For example, the cookingappliance surface can be the bottom wall of an oven, which is heated bythe oven heating element.

As mentioned, the cooking appliance surface includes a top surface. Atleast a portion of the top surface is non-hydrophobic. The top surfacecan be formed of metal, glass, ceramic, composites, or any othersuitable material, or combinations thereof. For example, the metal canbe porcelain enameled metal, plated metal, including steel, cast iron,and stainless steel, and combinations thereof. The glass can be, forexample, borosilicate glass, high temperature resistive glass, spunglass, glass fibers, and combinations thereof. The top surface caninclude a coating that allows for easy clean-up for a spill on thesurface. Such a coating, however, would not function to retain spills onthe top surface.

Referring to FIGS. 1-5, at least a portion of the top surface 10 isadapted to be heated by a heating element. For example, as shown inFIGS. 1-5, the top surface 10 can include burner regions 12 which areheated by a heating element. Referring to FIG. 6, the top surface 10, asused herein, can also be that of an oven wall, for example, the entiretyof which is adapted to be heated by an oven heating element 36. Thehydrophobic pattern 18 can be arranged in any pattern, as described indetail below. Referring to FIG. 7, the top surface 10, as used herein,can be the walls of an oven and, for example, the hydrophobic pattern 18can applied to the angles and bends of the recessed bottom wall of anoven to direct spills to flat non-hydrophobic spill containment regions20 that are easier for a user to clean. The cooking appliance surfacecan further include one or more of control knobs 14 a or control panels14 b, a fan 16, or other similar features. These features can bedisposed on or adjacent to the top surface 10.

The spill containment pattern, and particularly, a hydrophobic pattern18, is generally formed so as to be in the same plane as the cookingappliance surface. The spill containment pattern can be designed tocontain spills 22 resulting from over-boiling of a container of liquidor other food substance and/or to contain spills 22 of room temperatureliquids or other food substances resulting from the general cookingprocess, for example, when pouring liquid or other food substance into acontainer, when placing a full container on or over the cookingappliance surface, or when removing cooking utensils from pots on astove.

As mentioned, the spill containment pattern includes a hydrophobicpattern 18 disposed on the top surface, bounding at least a portion ofthe non-hydrophobic region of the top surface 10. The bounded portion ofthe non-hydrophobic region defines a non-hydrophobic spill containmentregion 20. The hydrophobicity of the hydrophobic pattern 18 repels aspilled liquid or other food substance and causes the same to bead up orpuddle up in the non-hydrophobic spill containment region 20. In someembodiments, the spill containment pattern can retain a spill 22 havinga height when pooled in the non-hydrophobic spill containment region 20of less than about 5.5 mm. For example, the spill containment patterncan retain a spill having a height of about 0.5 mm, about 1 mm, about1.5 mm, about 2 mm, about 2.5 mm, about 3 mm, about 3.5 mm, about 4 mm,about 4.5 mm, about 5 mm, or about 5.5 mm. The height of the spilledliquid provides a measure of the amount of spilled liquid retained by atop surface regardless of the area of the non-hydrophobic spillcontaining region of the top surface. The height of the retained spilledliquid is determined by dividing the volume of spilled liquid retainedby the top surface before failure (i.e. leakage) by the area of thenon-hydrophobic spill containing region.

The hydrophobic pattern 18 can be disposed in substantially the sameplane as the top surface 10. For example, the hydrophobic pattern 18 canhave a thickness of from about 0.001 microns to about 250 microns. Othersuitable thickness ranges include from about 0.001 microns to about 2microns, about 0.01 microns to about 1.5 microns, about 0.1 microns toabout 1 microns, about 0.001 microns to about 10 microns, about 0.01microns to about 8 microns, about 0.05 microns to about 7 microns, about0.1 microns to about 5 microns, about 1 micron to about 4 microns, about1 micron to about 10 microns, about 2 microns to about 8 microns, about4 microns to about 6 microns, about 10 microns to about 100 microns,about 20 microns to about 80 microns, about 40 microns to about 60microns, about 100 microns to about 250 microns, about 150 to about 200microns, about 1 micron to about 250 microns, about 10 microns to about200 microns, about 20 microns to about 150 microns, about 30 microns toabout 100 microns, about 40 microns to about 80 microns, and about 50microns to about 70 microns. Other suitable thickness include, forexample, about 0.001, 0.005, 0.01, 0.05, 0.1, 0.5, 1, 5, 10, 15, 20, 30,40, 50, 60, 70, 80, 90, 100, 110, 120, 130, 140, 150, 160, 170, 180,190, 200, 210, 220, 320, 240, and 250 microns.

A variety of spill containment patterns can be used depending on thedesired spill containment effect. Referring to FIGS. 1A and 1B, forexample, the hydrophobic pattern 18 can be in the form of a single,frame-like border that extends along the perimeter of the top surface10. In this case, a spill 22 (not shown) is prevented from exiting thetop surface, and rather is forced by the bounding hydrophobic pattern 18to remain in the non-hydrophobic spill containment region 20.

More specifically, the hydrophobic pattern 18 can include a continuouspattern formed of parallel left and right side edge containment strips18 a, 18 b, and parallel front and rear edge containment strips 18 c, 18d, i.e., all respectively engaged to adjacent ones. Each of the edgecontainment strips 18 a-18 d is generally uniform in width. In forming aframe-like border hydrophobic pattern 18, as shown in FIGS. 1A and 1B,the containment strips can be disposed directly at a respective edge ofthe top surface 10. That is, in the embodiment depicted in FIGS. 1A and1B, there is no non-hydrophobic area on the top surface 10 between thehydrophobic pattern 18 and the perimeter edge of the top surface 10. Inalternative embodiments of a frame-like hydrophobic pattern, however, atleast one of the strips 18 a-18 d can be offset inward from theperimeter edge of the top surface 10 such that the top surface caninclude a non-hydrophobic area disposed between at least a portion ofthe hydrophobic pattern 18 and the perimeter edge of the top surface 10.

The side edge containment strips 18 a, 18 b are disposed atsubstantially right angles relative to the front and rear edgecontainment strips 18 c, 18 d. So configured, the hydrophobic pattern 18of the embodiment depicted in FIGS. 1 A and 1B forms a continuous,generally square, rectangular, and/or box-shape completely bounding,encircling, and/or enclosing the non-hydrophobic spill containmentregion 20, which also has a generally square, rectangular, and/orbox-shape.

Referring to FIGS. 2A and 2B, the hydrophobic pattern 18 can also bearranged in a grid type pattern thereby defining a plurality ofnon-hydrophobic spill containment regions 20. The grid-like spillcontainment pattern includes a plurality of spaced apart longitudinalspill containment strips 18 e-1 to 18 e-n (n being the number oflongitudinal spill containment strips included in the pattern) and aplurality of lateral spill containment strips 18 f-1 to 18 f-m (m beingthe number of lateral spill containment strips included in the pattern).For example, the grid like pattern illustrated in FIG. 2A includes sevenlongitudinal spill containment strips 18 e-1 to 18-7, and eleven lateralspill containment strips 18 f-1 to 18 f-11. The longitudinal spillcontainment strips 18 e-1 to 18 e-n intersect the lateral spillcontainment strips 18 f-1 to 18 f-n at generally right angles. Asdepicted, the longitudinal spill containment strips 18 e-1 to 18 e-n areparallel to each other, as well as parallel to the left and right sidespill containment strips 18 a, 18 b (if present). Moreover, the lateralspill containment strips 18 f-1 to 18 f-n are parallel to each other, aswell as parallel to the front and rear spill containment strips 18 c, 18d (if present). Other configurations are intended to be within the scopeof the disclosure. For example, the respective sets of spill containingstrips could be angled to one another, or one or both of them could becurved or wavy. The grid-like pattern can also be disposed across theburner 12, the control knobs 14 a, the control panel 14 b, and/or thefan region 16. Alternatively, as shown in FIG. 2A, the burners 12 orother regions can remain uncovered by the grid-like pattern or any otherportion of the hydrophobic pattern 18.

The grid-like hydrophobic pattern 18 defines a plurality ofnon-hydrophobic spill containment regions 20 a-1 to 20 a-p (where p isthe number of non-hydrophobic spill containment regions disposed on thetop surface 10). In general, each of the non-hydrophobic spillcontainment regions 20 a-1 to 20 a-p is completely bounded, encircled,and/or enclosed by four of the spill containment strips and is thereforesquare, rectangular, and/or box-shaped. In the case where the gridpattern is not continuously disposed over the burners 12, control knobs14 a, control panels 14 b, or fan 16 regions, the non-hydrophobic spillcontainment regions disposed near those features may have a differentshape and may be bounded by four spill containment strips, with portionsof other spill containment strips being disposed within thenon-hydrophobic spill containment region 20. In the grid-likearrangement, each of the non-hydrophobic spill containment regions 20a-1 to 20 a-p is capable of containing a spill 22 (not shown) separatefrom the other non-hydrophobic spill containment regions 20 a-1 to 20a-p.

Referring to FIG. 3, the hydrophobic pattern can also comprise multipleframe-like borders on the top surface 10. For example, as illustrated inFIG. 3, the hydrophobic pattern 18 can have a double-borderconfiguration consisting of a first continuous hydrophobic surfaceborder 24 and a second continuous hydrophobic surface border 26 disposedinside of the first hydrophobic surface border 24.

The first hydrophobic surface border 24 can be disposed about theperimeter edge of the top surface 10, and the second hydrophobic surfaceborder 26 can be offset inwardly from the first hydrophobic surfaceborder 24. The first hydrophobic surface border 24 includes parallelleft and right side edge containment strips 24 a, 24 b, and parallelfront and rear edge containment strips 24 c, 24 d. Each of the edgecontainment strips 24 a-24 d of the first continuous hydrophobic surfaceborder 24 is generally uniform in width and arranged in an elongatedlinear configuration directly at the edge of the perimeter of the topsurface 10. The side edge containment strips 24 a, 24 b are disposed atright angles relative to the front and rear edge containment strips 24c, 24 d. So configured, the first hydrophobic surface border 24 forms acontinuous generally square, rectangular, and/or box-shape completelybounding, encircling, and/or enclosing the non-hydrophobic spillcontainment region 28, which is also generally square, rectangular,and/or box-shaped.

Moreover, as depicted, the second continuous hydrophobic surface border26 includes parallel left and right side edge containment strips 26 a,26 b, and parallel front and rear edge containment strips 26 c, 26 d.Each of the edge containment strips 26 a-26 d of the second hydrophobicsurface border 26 is generally uniform in width and arranged in anelongated linear configuration offset inwardly from the firsthydrophobic surface border 24. The side edge containment strips 26 a, 26b are disposed at right angles relative to the front and rear edgecontainment strips 26 c, 26 d such that the second hydrophobic surfaceborder 26 forms a generally square, rectangular, and/or box-shapecompletely bounding, encircling, and/or enclosing a portion of thenon-hydrophobic spill containment region 28 of the top surface 10. Soconfigured, the first and second hydrophobic surface borders 24, 26define a non-hydrophobic spill containment ring region 30 locatedbetween the two borders 24, 26. The non-hydrophobic spill containmentring region 30 can advantageously capture any spill overflow which mightescape from the non-hydrophobic spill containment region 28 and travelover the second hydrophobic surface border 26.

These and other variations in the spill containment pattern 18 can bemade without departing from the spirit and scope of the novel conceptsof the preferred embodiments of the present disclosure. For example,while FIG. 3 depicts a double-border pattern, a pattern of any numberconcentric or non-concentric border patterns could be provided on thetop surface 10. Each border pattern can, for example, surround at leasta portion of the non-hydrophobic region. Furthermore, a grid-likehydrophobic pattern can be formed in any of the non-hydrophobic spillcontainment regions to further define smaller non-hydrophobic spillcontainment regions.

Referring to FIGS. 4 and 5, the hydrophobic pattern 18 can be disposedto direct spills 22 away from a particular region of the cookingappliance surface, including, for example, heated regions of the topsurface, control knobs 14 a or panels 14 b, fan and vent openings, suchas an exhaust intake grill area 16 of a fan (not shown), cal rods, andthe like. For example, the hydrophobic pattern 18 can include a portion32 that is disposed adjacent to and/or surrounds the regions of the topsurface adapted to be heated by the heating element, thereby preventingspills 22 from entering the region of the top surface 10 adapted to beheated by the heating element. Referring to FIGS. 1-4, the hydrophobicpattern 18 can also include a portion 34 that is disposed adjacent to,surrounding, and/or covering control knobs 14 a, control panels 14 b,intake fan regions 16, surface-mounted timer/clocks, or any othersimilar feature which is disposed on or adjacent to the top surface 10.Any combination of the above-described hydrophobic pattern 18arrangements or any other hydrophobic pattern 18 arrangements can beused and can be designed so as to direct a spill 22 to a particularregion of the top surface 10.

To illustrate the concepts of liquid spillage, a spill 22 is illustratedin FIGS. 4 and 5. As shown in the figures, the hydrophobic pattern 18contains the spill 22 in the non-hydrophobic spill containment region20, thereby preventing the spill 22 from exiting the top surface 10.Portions of the hydrophobic pattern 32 and 34 disposed about the burnerregions 12 and the control knob 14 a, control panel 14 b, and fan intakeregion 16, prevent the spill from entering those regions. Thus, from theforegoing, the present disclosure encompasses a high temperature typesurface that includes hydrophobic (or super hydrophobic) patterns ofmaterials disposed thereon for (1) containing spills within apre-defined area, (2) repelling spills from a pre-defined area, as wellas (3) hydrophobic (or super hydrophobic) patterns specificallyconfigured to contain spills in some areas and simultaneously repelspills from other areas.

The hydrophobic pattern 18 is formed by applying a hydrophobic or superhydrophobic compound to the top surface 10 in the desired hydrophobicpattern 18 arrangement. A variety of hydrophobic or super-hydrophobiccompounds can be used to form the hydrophobic pattern, and the compoundscan be applied by a variety of methods. If it is desired to contain hotliquids, the hydrophobic or super-hydrophobic material should be adaptedto maintain its hydrophobicity when contacted with the hot liquids, soas to be able to repel the hot liquids and direct them to pool in thenon-hydrophobic spill containment region 20 of the top surface 10 of thecooking appliance surface. In general, as to domestic and professionalcooking procedures, hot liquids have a temperature in a range of 50° C.to about 210° C. For example, suitable hydrophobic materials for use inrepelling hot liquids can include, fluorocarbons, flurorpolymers such aspolytetrafluoroethylene (commercially available from DuPont as TEFLON),a superhydrophobic surface coating using TEFLON (See Van der Wal et al.,3 Soft Matter 426 (2009)), silicone based coatings, a composite ofpolytetrafluoroethylene (commercially available from DuPont as TEFLON)and carbon nanotubes (See Liu et al., 19 J. Materials Chem. 5602(2009)), and combinations thereof.

As described above, at least a portion of the top surface 10 of thecooking appliance surface is adapted to be heated by a heating element.In various embodiments of the disclosure, the hydrophobic pattern 18 isdisposed on or near the regions of the top surface 10 adapted to beheated by the heating element. In these embodiments, the hydrophobic orsuper-hydrophobic compound and any other compounds used to form thehydrophobic pattern 18 should be suitable for use on a heated surface.For example, the hydrophobic or super-hydrophobic material should besuitable for use on a surface having a temperature in a range of ambienttemperature to about 500° C. Preferably, the hydrophobic compound andany other compounds used to form the hydrophobic pattern 18 are stableand resilient against repeated heating and cooling cycles.

Examples of hydrophobic compounds for use in forming the hydrophobicpattern 18 include, for example, organic polymers, inorganic polymers,fluorocarbons, olefins, nanomaterials, nanomaterial-organic polymerblends, ceramics, and combinations thereof. The organic polymers includefluoropolymers, graph polymers, copolymers, and blends. Specificfluoropolymers include, for example, PTFE/polyphenylene sulfide blendsand copolymers, plasma deposited fluoropolymer coating from CFC-113 andC₂H₄, plasma deposited fluoropolymer coatings from precursors thatinclude CF4, C2F6, C4F8, and mixtures thereof, electrospuninitiated-chemical vapor deposited perfluoroalkyl ethyl methacrylate,fluoropolyamide-polyimide polymers, and fluorinated graph polymers. Alsosuitable are blends of polysulfone resins and fluoropolymers. Theinorganic polymers include, for example, organopolysiloxanes,fluoropolysiloxane, and fluorinated polyester modified polysiloxanepolymers. The fluorocarbons include, for example, fluoroalkyl silanes,fluoroalkoxy silanes, fluoroalkyl alkyl silanes, and combinationsthereof. Specific silanes include, for example,tridecafluoro-1,1,2,2-tetrahydrooctyl trichlorosilane,nonafluorohexyldimethyl-(dimethylamino)silane,heptadecafluorotetrahydrodecyldimethyl(dimethylamino)silane,tetrandyrodecyl-tris(dimethylamino)silane,tridecafluoro-1,1,2,2,-tetrahydrooctyl silane,(tridecafluoro-1,1,2,2-tetrahydooctyl)trimethoxysilane,(tridecafluoro-1,1,2,2-tetrahydooctyl)triethoxysilane, n-octadecyltrimethoxysilane, n-octyl triethoxysilane, andheptadecafluoro-1,1,2,2-tetrahedyodecyl-tris(dimethylamino)silane.Nanomaterials include, for example, colloidal silica, 60-nm SiO₂ onNH₃-terminated self-assembled monolayers, silica nanocrystals, silicananowires, silica nanofibers, silica nanorods, silica nanotrees,colloidal silica mixed with n-hexane, silica nanofibers coated with anorganic polymer, an inorganic polymer, fluoro and/or silyl compounds,e.g., PTFE, Tri-sil,tridecafluoro-1,1,2,2-tetrahydrooctyl-1-tricholorosilane,hexamethyldisilazane, aliphatic hydrocarbon containing molecules,aromatic hydrocarbon containing molecules, halogen containing molecules,and paralyene. Ceramics include, for example, patterned SiO₂/TiO₂surfaces treated with a fluoroalkylsilane, roughened silica, Si₃TiO₈,fumed silicon dioxide, silica aerogel, and glow discharged polymerizedsilicon. Other suitable ceramics include, for example, TiO₂, MgAl₂O₄spinels, diatomaceous earth, colloidal silver impregnated polymermatrices, carbonized lotus leaf, graphite on polytetrahaloethylene, ZnOand/or MgO deposited on polytetrahaloethylene, CVD deposited diamond,nano-laminas of boron nitride, hydrophobic zeolites, such as(SiO₂)₁₀₊(Al₂O₃), and hydrophobic aerogels.

Any method of applying the hydrophobic compound to form the hydrophobicspill containment pattern may be used. For example, the hydrophobiccompound can be applied using an application technique such as spraying;brushing; wiping; dipping; solvent casting; flow coating; curtaincoating; roller coating; spin coating; printing; screen printing; inkjet printing; vacuum coating; magnetic field-assisted cathodicsputtering; plasma deposition; plasma magnetron deposition; chemicalvapor deposition (“CVD”); plasma or atmospheric CVD; powder or liquidpyrolysis; atomization; electrophoretic deposition; cross-linkingprocesses; and combinations thereof.

In various embodiments the hydrophobic pattern 18 can be formed by firstroughening the portion of the top surface 10 to be made hydrophobicusing various methods, and then applying a hydrophobic compound to theroughened surface. Suitable roughening methods include, for example,sanding, abrading, etching, such as acid etching, or otherwise removingmaterial from the top surface 10.

Etching can be performed using, for example, hydrofluoric acid, sodiumsilicate, bifluorides, including for example, a ammonium bifluoridesodium bifluoride, and mixtures thereof, any other known etchingsolutions, and any mixtures thereof. Commercially available etchingsolutions are available, for example from Armour® Products (Hawthorne,New Jersey). For examples, the Armour Etch Bath® Glass Dipping Solution(product name) or Armour Etch®Glass Etching Cream (product name),available from Armour® Products can be used, and includes a mixture ofammonium bifluoride and sodium bifluoride. The etching solution can beapplied to the top surface 10 with an applicator in the desired pattern.A mask, which is resistant to the etching solution, can be placed on theregion of the top surface 10 to be non-hydrophobic to protect thisregion from being etched. The etching solution can be allowed to remainon the top surface for a time in a range of about 15 seconds to about 20minutes, about 20 seconds to about 15 minutes, about 30 seconds to about10 minutes, about 45 seconds to about 8 minutes, about 1 minute to about10 minutes, about 2 minutes to about 8 minutes, about 4 minutes to about6 minutes, about 15 seconds to about 1 minute, about 20 seconds to about50 seconds, about 25 seconds to about 45 seconds, about 30 seconds toabout 40 seconds, about 1 minute to about 20 minutes, about 5 to about15 minutes, or about 7 minutes to about 10 minutes. Other suitable timesinclude, for example, about 15 seconds, 20 seconds, 25 seconds, 30seconds, 35 seconds, 40 seconds, 45 seconds, 50 seconds, 55 seconds, 1minute, 2 minutes, 3 minutes, 4 minutes, 5 minutes, 6 minutes, 7minutes, 8 minutes, 9 minutes, 10 minutes, 11 minutes, 12 minutes, 13minutes, 14 minutes, 15 minutes, 16 minutes, 17 minutes, 18 minutes, 19minutes, and 20 minutes.

The hydrophobic pattern 18 can also be formed, for example, by providinga coating of hydrophobic particles on the surface, by using sol-geldeposition, either on top of or within the matrix of the sol-gel, byapplying a metal oxide primer with an integrated or separate hydrophobiccompound, by applying a hydrophobic compound comprising a variety ofmolecular chain lengths to create a coating with surface irregularities,or by adhering a thin material to the surface, such as a tape of thinglass or plastic which has been made hydrophobic. The hydrophobicpattern 18 can be formed, for example, by applying a frit material, suchas a ceramic or porcelain frit material, with or without structureforming particles therein, to the top surface 10 in the desired patternarrangement, curing the frit, and then applying a hydrophobic compoundover the cured frit and curing the hydrophobic compound. The frit can bea ceramic frit, a porcelain frit, or a combination thereof. In someembodiments, the frit layer can have a thermal insulating effectsufficient to prevent or reduce the amount of heat transfer that mayoccur between the top surface and the hydrophobic material appliedthereto, thereby increasing the useful life of the hydrophobic patternby reducing potential thermal degradation.

Any combination of the above-described surface treatment methods can bealso be used. For example, the top surface 10 can be first prepared byapplying and curing a frit material to the top surface 10. The fritmaterial can then be etched using an etching solution as describedabove, and a hydrophobic compound can be applied to the etched frit.Alternatively, the entire top surface 10 including the frit material canbe etched using an etching solution, and a hydrophobic compound can thenbe applied to the etched ceramic frit. Without intending to be bound bytheory, it is believed that etching the frit prior to application of thehydrophobic compound can improve the hydrophobic properties of thehydrophobic pattern 18 by creating additional bonding sites on the fritto which the hydrophobic compound can bond. Additionally, the etchedfrit may include more surface area to which the hydrophobic compound canattached by virtue of the combined macro-scale surface rougheningprovided by the frit and micro-scale surface roughening provided byetching the frit.

The hydrophobic surface treatments described herein can be curedaccording to a number of different methods, if curing is required by thesurface preparation or the hydrophobic compound, including withoutlimitation: conduction heating; convection heating; UV radiation; VUVradiation; electron beam irradiation; ionizing radiation; laser; IR; andthermal radiation. The hydrophobic surface treatments can also be curedby remaining at ambient conditions for a sufficient length of time, forexample, from about 16 hours to about 48 hours, from about 20 hours toabout 40 hours, and from about 25 hours to about 35 hours. Curing can beperformed in a controlled humidity environment. For example, curing canbe performed at less than 70% humidity, less than 60% humidity, lessthan 50% humidity, less than 40% humidity, less than 30% humidity, lessthan 20% humidity, less than 10% humidity, or at 0% humidity.

In one embodiment, the cooking appliance assembly comprises a glass, aglass ceramic, or a tempered glass top surface 10 which is printed,e.g., screen printed, with a frit material, over which a hydrophobiccoating can be applied if needed to impart hydrophobicity to the frit.The frit can be patterned on the top surface 10 using any known placing,printing, or other patterning methods. The frit material is placed orprinted in a pattern, for example, a frame-like border pattern on thetop surface 10, which defines at least a portion of the spillcontainment pattern. For example, the frit material can be screenprinted onto the top surface 10 in the desired pattern using, forexample, a silk screen having a mesh count in a range of about 80 toabout 360, about 100 to about 300, about 120 to about 280, about 140 toabout 240, about 160 to about 220, about 180 to about 200, about 86 toabout 360. Other suitable mesh counts include about 80, 82, 84, 86, 88,90, 92, 94, 96, 98, 100, 110, 120, 130, 140, 150, 160, 170, 180, 190,200, 210, 220, 320, 240, 250, 260, 270, 280, 290, 300, 310, 320, 340,350, and 360. Various other mesh counts may be suitable depending on thecomposition and particle size of the frit material used. As described inabove, the hydrophobic pattern 18, and consequently, the frit pattern,can have a variety of shapes and sizes, and can be placed in a varietyof locations on the glass top surface 10. Additionally, portions of thehydrophobic pattern 18 can be formed, for example, using differenthydrophobic compounds and/or different surface treatments. For example,a portion of the hydrophobic pattern 18 can be formed, for example, byapplying and curing a ceramic frit to the top surface 10 and applying ahydrophobic compound to the cured frit, and another portion of thehydrophobic spill containment pattern can be formed, for example, byacid etching a portion of the top surface 10 and applying thehydrophobic compound to the etched portion.

In accordance with various aspects of the invention, the frit materialcan include finely ground particles. For example, the ceramic fritmaterial can include lead oxide, silicon dioxide, aluminum oxide, andmixtures thereof. Preferably, the frit material includes silicondioxide. For example, the frit material includes from 5 weight percent(wt. %) to about 100 wt. % silicon dioxide, from about 10 wt. % to about80 wt. %, from about 20 wt. % to about 60 wt. % from about 30 wt. % toabout 40 wt. % from about 15 wt. % to about 75 wt. %, from about 20 wt.% to about 50 wt. %. Other suitable amounts of silicon dioxide in thefrit material can include, for example, 5, 10, 15, 20, 25, 30, 35, 40,45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95 and 100 wt. %. The ceramicfrit material can include about 29 wt. % silicon dioxide. The ceramicfrit material can also include, for example, additives, such as tantalumoxide, titanium dioxide, calcium oxide, zirconium oxide, sodium oxide,potassium oxides, iron oxide magnesium oxide, barium oxide, bismuthoxide, and mixtures thereof. Suitable commercially available fritmaterials can be used. For example, a commercially available fritmaterial is available from Ferro Corp. (hereinafter “the Ferro frit”)under Product No. A0430 Etch C32 Medium, and contains about 53.71 wt. %lead oxide, about 29 wt. % silicon dioxide, 15.72 wt. % aluminum oxide,0.39 wt. % tantalum oxide, 0.38 wt. % titanium dioxide, 0.28 wt. %calcium oxide, 0.26 wt. % zirconium oxide, 0.11 wt. % sodium oxide, 0.04wt. % potassium oxide, 0.04 wt. % iron oxide, 0.03 wt. % magnesiumoxide, 0.02 wt. % barium oxide, and 0.02 wt. % bismuth oxide. Anothersuitable a commercially available frit material is available from FerroCorp. (hereinafter “the Ferro frit”) under Product No. GAL-41727, andcontains about 36.25 wt. % lead oxide, about 33.82 wt. % silicondioxide, 4.31 wt. % aluminum oxide, 19.74 wt. % zinc oxide, 5.50 wt. %titanium dioxide, 0.13 wt. % potassium oxide, 0.08 wt. % iron oxide,0.07 wt. % zirconium oxide, 0.04 wt. % niobium oxide, 0.02 wt. % calciumoxide, 0.02 wt. % magnesium oxide, 0.01 wt. % cobalt oxide, and 0.01 wt.% nickel oxide.

The particles of the frit material may be mixed with inorganic ororganic pigments or dyes, so as to yield a desired color. The fritmaterial may be provided as a dry powder or as a paste or other suchmixture. Once the frit material is placed on the top surface 10, thefrit is then coupled to the top surface 10. For example, the frit can becoupled to the top surface 10 by fusing the frit to the top surface 10.The frit can be coupled or fused to top surface 10 by heating the topsurface 10 to a temperature in a range of about 1000° F. to about 1400°F., about 1100° F. to about 1300° F., about 1100° F. to about 1200° F.,and about 1200° F. to about 1400° F. Other suitable temperatures includeabout 1000° F., 1050° F., 1100° F., 1150° F., 1200° F., 1250° F., 1300°F., 1350° F., and 1400° F. This heat treatment will cause the particlesof the frit to cure by fusing to each other and to the glass surface toform a continuous structure and thereby couple the frit to the topsurface 10. The pattern of the fused frit will be substantiallyidentical to the pattern in which the frit material was placed on thetop surface 10. It is believed that this fused frit coating can becharacterized as being nearly as hard and tough as the glass itself.

In one embodiment, the frit can include some micro-scale additiveparticles which will remain unmelted at the temperature at which thefrit is sintered, as described for example in U.S. Pat. Nos. 4,591,530,6,872,441, 6,800,354, 5,324,566, and 5,437,894, the disclosures of whichare incorporated herein by reference in their entirety. The frit isprinted or placed in the pattern of a frame-like border at or near theouter perimeter of the cooking appliance surface or other desiredlocation for the spill containment pattern. The surface with the printedfrit is then heated to a temperature above the melting point of theprimary components of the frit material, but below the melting point ofthe material of the cooking appliance surface, for a time sufficient tocure the frit so that it is fused or bonded to the surface. The specifictime and temperature required to sinter the frit will vary based on thematerials chosen for the frit.

The hydrophobic compound can be applied to the frit material as ahydrophobic solution, which includes a solvent and the hydrophobiccompound dissolved or dispersed in the solvent. The solvent can be, forexample, dry or wet hexane. Suitable solvents include, for example,hexane, heptanes, methyl chloride, naptha, toluene, acetone,perfluorocarbons, and mixtures thereof. The hydrophobic solution caninclude from about 0.1% to about 5% of hydrophobic compound. Othersuitable ranges include, for example, about 0.5% to 4%, about 1% toabout 3%, about 1% to about 5%, and about 2% to about 4%. Suitableamounts of the hydrophobic compound in the hydrophobic solution, caninclude, for example, about 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9,1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, and 5%. For example, a 1% solution oftridecafluoro-1,1,2,2-tetrahydrooctyl trichlorosilane, a perfluoroalkylalkyl silane, in hexane, can be applied, for example by wiping thesolution onto the cooking appliance surface or a frit or other surfacepretreatment, or applying the solution using an applicator tip, or byusing any other known method. The hydrophobic compound can be applied tothe solution using, for example, a one pass method in which a coatedapplicator is swept across the region designed as the spill containmentpattern a single time or a multiple pass method in which the applicatoris passed over the frit border two or more times.

The hydrophobic solution is then cured by heating it and/or exposing itto controlled humidity for a period of time. For example, conductiveheating, convention heating, thermal radiation, UV radiation, VUVradiation, electron beam irradiation, ionizing radiation, laser, IR canbe used to cure the hydrophobic solution. The hydrophobic solution canbe cured, for example, at a temperature in a range of about 100° F. toabout 600° F., about 150° F. to about 550° F., about 200° F. to about500° F., about 250° F. to about 450° F., about 300° F. to about 350° F.,or about 100° F. to about 300° F. Other suitable temperatures include,for example, about 100° F., 150° F., 200° F., 250° F., 300° F., 350° F.,400° F., 450° F., 500° F., 550° F., and 600° F. The hydrophobic solutioncan be cured, for example, by heating for a time in a range of about 2seconds to about 1 hour, about 2 seconds to about 1 minute, about 4seconds to about 50 seconds, about 6 seconds to about 40 seconds, about8 seconds to about 30 seconds, about 10 seconds to about 20 seconds,about 2 seconds to about 5 seconds, about 25 seconds to about 1 minutes,about 5 minutes to about 1 hour, about 10 minutes to about 45 minutes,about 20 minutes to about 30 minutes, about 10 minutes to about 20minutes, and about 15 minutes to about 30 minutes. Other suitable timesinclude, for example, about 2 seconds, 4 seconds, 6 seconds, 8 seconds,10 seconds, 15 seconds, 20 seconds, 25 seconds, 30 seconds, 35 seconds,40 seconds, 50 seconds, 55 seconds, 60 seconds, 5 minutes, 10 minutes,15 minutes, 20 minutes, 25 minutes, 30 minutes, 35 minutes, 40 minutes,45 minutes, 50 minutes, 55 minutes, and 60 minutes.

Alternatively, the hydrophobic solution can be cured without heating.Heating, however, can accelerate the curing process. For example, thehydrophobic solution can be allowed to cure by leaving the glass topsurface 10 having the cured ceramic frit coated with the hydrophobicsolution in ambient conditions for a time in a range of about 16 toabout 48 hours, about 20 to about 40 hours, about 25 to about 35 hours,about 16 to about 24 hours, or about 20 hours to about 30 hours. Thehydrophobic solution can be cured, whether at elevated temperatures orat ambient temperature, in relatively dry environment. For example, thehydrophobic solution can be cured in an environment having less than 70%humidity, less than 60% humidity, less than 50% humidity, less than 40%humidity, less than 30% humidity, less than 20% humidity, less than 10%humidity, or at 0% humidity. Upon curing, the hydrophobic compoundpreferably forms a continuous hydrophobic layer on the fused frit orother surface treatment.

Without intending to be bound by theory, it is believed that in the caseof a fluorosilane, bonding is achieved between surface Si—OH containedon and extending from the surface of the fused frit material or othermodified top surface 10 surface, such as, for example, an acid etchedsurface, and the Si—OH groups of the silane. The surface hydroxyl groupscan results from partial hydrolysis of the silane and the silicondioxide in the fused frit material during heating. The Si—OH groups arecaused to react with corresponding groups to form Si—O—Si linkagesbetween the silane and the fused frit material. Correspondingly, Si—OHgroups of adjacent silane molecules are also caused to react and formSi—O—Si cross linkages, thereby forming a continuous hydrophobic layeracross the frit material. The method described herein will produce ahydrophobic surface that is a continuous border around the perimeter ofthe top surface 10 which will operate as a spill containment feature.The bonding of other hydrophobic materials to the modified top surface10 can occur through chemical or physical adhesions mechanisms. It isbelieved that silane nanomaterials bind to the surface through ananalogous binding mechanism as described for the binding offluorosilanes, above. Other nanomaterials may bind through similarchemical adhesion mechanisms, through molecular rearrangement, orthrough interpenetration with the top surface 10. Electrodeposition,chemical vapor deposition, electrophoretic deposition, sputtering, andother physiochemical deposition methods yield materials bound to the topsurface 10 through physiochemical and electrochemical bonds that aredependant on the chemical formulation of the deposited hydrophobicmaterial.

One advantage of using a ceramic frit material to prepare the topsurface 10 for coating with the hydrophobic solution as describedherein, in addition to improving the durability of the hydrophobicsurface, is that frit material is commercially available in multiplecolors and can be printed in a manner which allows for the inclusion ofdesigns, company names or logos in the surface area where the fritmaterial is applied to the top surface 10.

Preferably, the hydrophobic pattern 18 is durable, and resists chipping,peeling, fading, and scratching. Advantageously, the hydrophobic pattern18 can be designed to be resistant to abrasions from common householdcontainers, such as, for example, pots, pans, cooking utensils, andother such cooking containers, as well as glass jars and other foodcontainers. In addition, the hydrophobic pattern 18 can be designed tobe resistant to most chemicals, such as for example, dish soap, Windex,Sparkle, Clorox wipes, and Formula 409 All Purpose Cleaner. Thehydrophobic pattern 18 can resist multiple cleanings withoutexperiencing a decrease in the spill containment pattern's ability toretain a spill.

It will be apparent to those skilled in the pertinent arts that otherembodiments of cooking appliance and cooking appliance surfaces inaccordance with the disclosure may be designed. That is, the principlesof cooking appliance surfaces in accordance with the disclosure are notlimited to the specific embodiments described herein. For example,cooking appliance surface having a spill containment pattern could beused in various settings, such as toaster ovens, indoor grillingappliances, or the like.

Further, it will be apparent to those skilled in the pertinent art thatany method which may be used for creating a hydrophobic pattern insubstantially the same plane as the top surface of the cooking appliancesurface is within the scope of the disclosure described herein, even ifsuch method requires the use of multiple pieces to manufacture thecooking appliance surface. For example, a frame of hydrophobic materialmay be bonded to the top surface of the cooking appliance surface suchthat it forms a continuous border which is generally in the same planeas the top surface. Accordingly, it will be apparent to those skilled inthe art that modifications and other variations of the above-describedillustrative embodiments of the disclosure may be effected withoutdeparting from the spirit and scope of the novel concepts of theinvention.

1-62. (canceled)
 63. A method of manufacturing a cooking appliancesurface capable of containing spills thereon comprising: providing acooking appliance surface comprising a top surface having anon-hydrophobic region, wherein at least a portion of the cookingappliance surface is adapted to be heated or affected by at least oneheating element; and forming a hydrophobic pattern on the top surface,the hydrophobic pattern arranged to bound at least a portion of thenon-hydrophobic region, the bounded non-hydrophobic region defining anon-hydrophobic spill containment region. 64-67. (canceled)
 68. Themethod of claim 63, wherein applying a hydrophobic pattern comprises:applying a frit to the top surface, the frit arranged in pattern of thehydrophobic pattern; curing the frit to couple the frit to the topsurface; applying a hydrophobic compound to the cured frit; and curingthe hydrophobic compound.
 69. The method of claim 68, wherein the fritis a ceramic frit, a porcelain frit, or a combination thereof.
 70. Themethod of claim 68, wherein curing the frit comprises heating the fritto a temperature in a range of about 1000° F. to about 1400° F.
 71. Themethod of claim 68, wherein curing the hydrophobic compound comprisesheating the hydrophobic compound to a temperature in a range of about100° F. to about 600° F.
 72. The method of claim 68, wherein curing thehydrophobic compound comprises exposing the hydrophobic compound toambient temperature.
 73. The method of claim 63, wherein applying thehydrophobic pattern comprises applying a hydrophobic solution comprisingthe hydrophobic compound dispersed or dissolved in a solvent. 74-76.(canceled)
 77. The method of claim 63, comprising applying thehydrophobic pattern in the form of a continuous border, which defines asingle non-hydrophobic spill containment central region within saidborder.
 78. The method of claim 77, wherein the continuous border isdisposed near the perimeter of the top surface.
 79. (canceled)
 80. Themethod of claim 63, wherein a portion of the hydrophobic patternsurrounds the portion of the cooking appliance surface adapted to beheated by the heating element. 81-86. (canceled)
 87. The method of claim63, comprising forming the hydrophobic pattern in substantially the sameplane as the top surface.
 88. (canceled)
 89. The method of claim 63,wherein the hydrophobic pattern comprises hydrophobic particles.
 90. Themethod of claim 63, wherein the hydrophobic pattern is formed to athickness in the range of approximately 0.001 microns to approximately250 microns.
 91. (canceled)
 92. The method of claim 63, wherein thecooking appliance surface is selected from the group consisting of ovenwalls, a cooktop cooking surface, and a stovetop cooking surface.93-100. (canceled)